Analysis of surface defects types and causes of stamped electroplastic copper products
Publish Time: 2025-01-13
During the manufacturing process of stamped electroplastic copper products, various defects may appear on their surface due to the influence of various factors. These defects not only affect the appearance quality of the product, but may also have an adverse effect on its performance and service life. The following is a detailed analysis of the types of surface defects and their causes of stamped electroplastic copper products.First, scratches are one of the common surface defects of stamped electroplastic copper products. Scratches are usually caused by wear and paint peeling on the surface of the stamping die or improper operation by the operator. During the stamping process, the friction between the die and the material generates heat. If there is wear or paint peeling on the surface of the die, it is easy to leave scratches on the surface of the material. In addition, the operator's negligence, such as improper placement of the material or die, may also cause scratches.Second, oxidation is another common surface defect. When stamped electroplastic copper products are exposed to air for a long time, they will react with oxygen and cause surface oxidation. Oxidation will darken the surface color of the product and may produce rust, which seriously affects the appearance and corrosion resistance of the product.In addition, cracks are also a kind of surface defects of stamped electroplated copper products. Cracks are usually caused by improper selection of punch presses during stamping, material strength that does not meet requirements, or inappropriate setting of punch press process parameters. Cracks will reduce the strength and toughness of the product, and may even cause the product to break during use.In addition to the above defects, bulges and depressions are also common surface problems of stamped electroplated copper products. These defects are usually caused by improper die height setting or uneven material flow during stamping. Bumps and depressions not only affect the appearance quality of the product, but may also affect the dimensional accuracy and assembly performance of the product.For these surface defects, a series of measures can be taken to prevent and repair them. For example, regularly maintain and maintain the stamping die to ensure that its surface is flat and smooth; optimize the stamping process parameters, select suitable punch presses and materials; strengthen the training and management of operators to improve their operating skills and quality awareness; and properly pretreat the material before electroplating, such as degreasing and rust removal, to improve the adhesion and uniformity of the electroplating layer.In summary, the surface defects of stamped electroplated copper products are diverse and their causes are complex. In order to improve product quality and reduce production costs, it is necessary to strengthen the analysis and research on the causes of defects and take effective prevention and repair measures.
