Strategy for improving the interfacial bonding strength between electrodes and plastic substrates in injection molding pre-embedded processing
Publish Time: 2025-01-27
Injection molding pre-embedded processing is a technology that pre-embeds components such as electrodes into a mold and then combines them with a plastic substrate through injection molding. This process is widely used in the manufacture of electronic devices, especially in areas that require high integration and compact structure. However, the interfacial bonding strength between the electrode and the plastic substrate is one of the key factors affecting the quality and performance of the final product. Therefore, improving this bonding strength is an important topic in injection molding pre-embedded processing.First, the selection of electrode materials is crucial. The electrode material should have good compatibility with the plastic substrate to ensure that a good interfacial bonding can be formed during the injection molding process. Generally, metals such as copper and silver are widely used due to their good conductivity and processability. However, the thermal expansion coefficients of these metals and plastics are quite different, which may cause stress during the injection molding cooling process, thereby affecting the interfacial bonding strength. Therefore, selecting an electrode material with a suitable thermal expansion coefficient or using a composite material is an effective strategy to improve the interfacial bonding strength.Secondly, the optimization of injection molding process parameters is also key. Increasing the melt temperature, injection pressure and injection speed is conducive to improving the filling flow effect of the plastic melt on the electrode surface, thereby enhancing the interface bonding. However, excessive temperature and pressure may cause electrode deformation or degradation of the plastic substrate, so it is necessary to finely control the process parameters to find the best balance point.In addition, interface treatment technology is also an important means to improve the bonding strength. For example, pretreatment of the electrode surface, such as sandblasting, chemical etching or electroplating, can increase the surface roughness and improve the mechanical interlocking effect between the plastic melt and the electrode. At the same time, the use of specific interface adhesives or compatibilizers can also significantly improve the interface bonding strength.In summary, improving the interface bonding strength between the electrode and the plastic substrate in injection molding pre-embedded processing requires multiple aspects such as electrode material selection, injection molding process parameter optimization and interface treatment technology. By comprehensively considering these factors and formulating appropriate processing strategies, the quality and performance of the final product can be significantly improved to meet the needs of electronic equipment for high integration and compact structure. At the same time, with the continuous development of materials science and injection molding technology, more innovative methods and technologies will be applied to this field in the future, further promoting the development and application of injection molding pre-embedded processing technology.
